LED technology is constantly improving, and the quality of products that users can finally use will become better and better. Many commercial needs are driving the progress of the commercial industry chain. When the technology reaches a certain level, the cost is reduced and the use is simple, civilian use will become more and more. close. LED has gone through a long period of time from ordinary traditional printing, to flip chip, to COB. The flip-chip printing process mainly includes: precise positioning printing of solder paste, precise die bonding, and reflow soldering. Among them, the quality of solder paste printing has a great impact on the quality of chip mounting products. According to industry evaluation and analysis, shallow tin, high void rate, and black solder paste are all caused by poor solder paste printing and improper reflow soldering curve settings. In solder paste printing, there are three important parts, solder paste, stencil, and printing equipment. If you can choose correctly, you can get a good printing effect..
The flip-chip printing process of Transparent LED Film Display can be divided into two types: one is to use stencil as a printing plate to print solder paste on the substrate, which is suitable for mass production and is currently the most commonly used coating method - planar printing;
1. The printed substrate is required to be flat and free of bumps.
2. A large amount of printing can be carried out at one time without limitation.
3. The plate making is relatively simple, the cost is very low, and it is popular.
4. High mass production and good reliability of printed solder paste.
5. The equipment is cheap.
Disadvantages of lithography:
1. It is not suitable for some special printing products, such as concave-convex substrates.
2. If the solder paste is not strong enough and relatively thin when printing, it generally needs to be printed twice to achieve the desired effect.
3. Because the durability of the stencil is not high during printing, it will lead to frequent replacement of the stencil. The application range of flat printing is very wide, and it is generally used on flat COB, integrated and other substrates. The other is injection coating, that is, solder paste jet printing technology. The most obvious difference from stencil printing technology is that jet printing technology is a non-stencil technology. A unique injector jets tin at a very high speed above the substrate. Paste, similar to inkjet printers - jet printing.
Advantages of jet printing:
1. The printing speed is extremely fast.
2. Adjustable printing shape: The shape of the printing solder paste can be adjusted, and can be adjusted arbitrarily according to the substrate and chip.
3. Wide range of application fields It is suitable for some special printing products, such as concave-convex substrates, which can be printed arbitrarily.
4. High mass production, good reliability of printed solder paste.
We have LED Transparent Film Screen for sale, please contact us if you are interested.